The development of electronic products is changing with each passing day. With the advent of the 5G era, there are higher requirements for the thermal conductivity and light weight of product structural parts. A high thermal conductivity die-casting magnesium alloy has been developed.

The thermal conductivity of HITCM series magnesium alloys is 95-116W/m.k, which is ~70% higher than the commonly used magnesium alloy AZ91D in the market. The HITCM series of magnesium alloys have the advantages of lightweight, thermal conductivity, and forming, providing a material basis for product innovation in the automotive and electronic fields.